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| November 2006 rev 0.3 Low Power Peak EMI Reducing Solution Features * * * * * * * * * ASM3P2775A The ASM3P2775A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The ASM3P2775A modulates the output of a single PLL in order to "spread" the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal's bandwidth is called `spread spectrum clock generation'. Generates an EMI optimized clock signal at the output. Integrated loop filter components. Operates with a 3.3V Supply. Operating current less than 4mA. Low power CMOS design. Input frequency range: 13MHz to 30MHz Generates a 1X low EMI spread spectrum clock of the input frequency. Frequency deviation: 1.75% (Typ) @14.7MHz Input Frequency. Available in 6-pin TSOT-23, 8-pin SOIC and 8pin TSSOP packages. Applications The ASM3P2775A is targeted towards all portable devices with very low power requirements like MP3 players and digital still cameras. Product Description The ASM3P2775A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The ASM3P2775A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The ASM3P2775A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. Key Specifications Description Supply voltages Cycle-to-Cycle Jitter Output Duty Cycle Modulation Rate Equation Frequency Deviation Specification VDD = 3.3V 0.3V 200pS (Max) 45/55% (worst case) FIN/640 1.75% (Typ) @ 14.7MHz Block Diagram VDD PD Modulation XIN/CLKIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter PLL VCO Output Divider ModOUT VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 * Tel: 408-879-9077 * Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. November 2006 rev 0.3 Pin Configuration (6-pin TSOT- 23 Package) ASM3P2775A PD 1 XOUT 2 6 VSS ModOUT VDD ASM3P2775A 5 4 XIN / CLKIN 3 Pin Description Pin# 1 2 3 4 5 6 Pin Name PD XOUT XIN / CLKIN VDD ModOUT VSS Type I O I P O P Description Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. Crystal connection. If using an external reference, this pin must be left unconnected. Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Power supply for the entire chip. Spread spectrum clock output. Ground connection. Pin Configuration (8-pin SOIC and TSSOP Package) XIN / CLKIN 1 XOUT 2 PD 3 NC 4 8 7 6 5 VDD NC ModOUT VSS ASM3P2775A Pin Description Pin# 1 2 3 4 5 6 7 8 Pin Name XIN/CLKIN XOUT Type I O I - P O - P Description Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Crystal connection. If using an external reference, this pin must be left unconnected. Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. No connect. Ground connection. Spread spectrum clock output. No connect. Power supply for the entire chip. PD NC VSS ModOUT NC VDD Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 2 of 10 November 2006 rev 0.3 Modulation Profile ASM3P2775A Specifications Description Frequency Range Modulation Equation Frequency Deviation Specification 13MHz < CLKIN < 30MHz FIN/640 1.75% (Typ) @ 14.7MHz Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) Parameter Voltage on any pin with respect to Ground Rating -0.5 to +4.6 -65 to +125 -40 to +85 260 150 2 Unit V C C C C KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 3 of 10 November 2006 rev 0.3 DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25C) unless otherwise stated) ASM3P2775A Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH IDD ICC VDD tON ZOUT Input low voltage Input high voltage Input low current Input high current Parameter Min VSS - 0.3 2.0 - - - - - 2.5 - - 3.0 - - Typ - - - - 3 3 - - - 3.5 3.3 - 45 Max 0.8 VDD + 0.3 -35 35 - - 0.4 - 10 - 3.6 5 - Unit V V A A mA mA V V uA mA V mS XOUT output low current (@0.4V, VDD=3.3V) XOUT output high current (@2.5V, VDD=3.3V) Output low voltage (VDD = 3.3 V, IOL = 8 mA) Output high voltage (VDD = 3.3 V, IOH = 8 mA) Static supply current* Dynamic supply current (3.3V, 16MHz and no load) Operating voltage Power-up time (first locked cycle after power-up)** Output impedance * XIN /CLKIN pin and PD pin are pulled low ** VDD and XIN/CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics Symbol CLKIN ModOUT fd tLH* tHL * tJC tD Input frequency Output frequency Frequency Deviation Input Frequency = 13MHz Input Frequency = 30MHz Parameter Min 13 13 - - 0.5 0.3 - 45 Typ - - 1.8% 1.1% 1.1 0.8 200 50 Max 30 30 - - 1.3 1.0 - 55 Unit MHz MHz % nS nS pS % Output rise time (measured from 0.8 to 2.0V) Output fall time (measured at 2.0V to 0.8V) Jitter (cycle to cycle) Output duty cycle *tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 4 of 10 November 2006 rev 0.3 Typical Crystal Oscillator Circuit ASM3P2775A Crystal R1 = 510 C1 = 27 pF C2 = 27 pF Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency Frequency tolerance Operating temperature range Storage temperature Load capacitance Shunt capacitance ESR 14.31818MHz 50 ppm or better at 25C -25C to +85C -40C to +85C 18pF 7pF maximum 25 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 5 of 10 November 2006 rev 0.3 Package Information 6-pin TSOT-23 Package ASM3P2775A Dimensions Symbol Min A A1 A2 b H D B e C L ..... 0.00 0.033 0.012 Inches Max 0.04 0.004 0.036 0.02 Millimeters Min Max ...... 0.00 0.84 0.30 0.127 BSC 2.90 BSC 1.60 BSC 0.950 BSC 2.80 BSC 0.30 0 0.50 4 1.00 0.10 0.90 0.50 0.005 BSC 0.114 BSC 0.06 BSC 0.0374 BSC 0.11 BSC 0.0118 0 0.02 4 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 6 of 10 November 2006 rev 0.3 8-Pin SOIC Package ASM3P2775A E H D A2 A e B A 1 C L D Dimensions Symbol Min A1 A A2 B C D E e H L Inches Max 0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007 Millimeters Min 0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0 1.27 8 Max 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0 0.050 8 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 7 of 10 November 2006 rev 0.3 8-Pin TSSOP Package ASM3P2775A H E D A2 A e B A1 L C Dimensions Symbol Min A A1 A2 B c D E e H L 0.020 0 ...... 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8 0.50 0 Inches Max 0.043 0.006 0.037 0.012 0.008 0.122 0.177 Millimeters Min ...... 0.05 0.85 0.19 0.09 2.90 4.30 0.65 BSC 6.40 BSC 0.70 8 Max 1.10 0.15 0.95 0.30 0.20 3.10 4.50 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 8 of 10 November 2006 rev 0.3 Ordering Information Part Number ASM3P2775AF-06OR ASM3P2775AF-08TT ASM3P2775AF-08TR ASM3P2775AF-08ST ASM3P2775AF-08SR ASM3P2775AG-06OR ASM3P2775AG-08TT ASM3P2775AG-08TR ASM3P2775AG-08ST ASM3P2775AG-08SR ASM3P2775A Marking X4LL 3P2775AF 3P2775AF 3P2775AF 3P2775AF X3LL 3P2775AG 3P2775AG 3P2775AG 3P2775AG Package Type 6-Pin TSOT-23, TAPE & REEL, Pb Free 8-Pin TSSOP, TUBE, Pb Free 8-Pin TSSOP, TAPE & REEL, Pb Free 8-Pin SOIC, TUBE, Pb Free 8-Pin SOIC, TAPE & REEL, Pb Free 6-Pin TSOT-23, TAPE & REEL, Green 8-Pin TSSOP, TUBE, Green 8-Pin TSSOP, TAPE & REEL, Green 8-Pin SOIC, TUBE, Green 8-Pin SOIC, TAPE & REEL, Green Temperature Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Device Ordering Information ASM3P2775AG-08TR R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 PulseCore Semiconductor Mixed Signal Product Licensed under U.S Patent Nos 5,488,627 and 5,631,921 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 9 of 10 November 2006 rev 0.3 ASM3P2775A PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008. Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright (c) Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P2775A Document Version: v0.3 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 (c) Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore's best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore's Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore's Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 10 of 10 |
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